1. The main role of silver glue is: fixability, conductivity, conductivity
The old silver glue can't be mixed with the new silver glue, especially the frozen and warmed unstirred silver glue. The silver powder below is heavy, which leads to poor adhesion and easy separation from the wafer or the support. The silver powder on the top is less conductive, VF After the high-silver glue is solid crystal, it should be baked in time, and it can't stay too long.
2. Silver glue instead of insulating rubber Some advantages : can overcome the capillary phenomenon of the chip, good silver glue can make the LED light flux uniform, the spot is even
3. Effect of curing time and temperature of silver glue on volume resistance 1) Normally, the higher the curing temperature, the smaller the volume resistance, but the high temperature curing silver gel is 130 ° C, below 85 ° C, may not conduct electricity, because the curing temperature and The curing time is inversely proportional. The longer the curing time, the more obvious the wetting effect of the silver colloidal particles. (The silver colloidal component is 75-85% of the silver colloidal particles, and the epoxy resin and the catalyst). The wetting action means that the silver colloidal particles are encapsulated by epoxy resin. Overlay phenomenon, and the epoxy resin is not conductive. Under normal storage, the silver rubber particles will not be completely wetted by the epoxy resin, but under warm conditions, the moisture will be accelerated.
b) The higher the curing temperature, the greater the stress generated. The silver glue has the same thermal conductivity as the insulating glue (mainly the silver particles are conductive), but the silver particles also cause thermal conduction barrier, which means that the thermal conductivity of silver paste is higher than that of insulation. However, the actual thermal conductivity is not good, and the actual thermal conductivity is not completely determined by the thermal conductivity of the adhesive. It is also related to many other aspects, such as the thickness of the adhesive layer, the thinner the adhesive layer, the more the chip and the substrate. The better the combined thermal conductivity, the larger the contact area between the chip and the substrate, and the better the thermal conductivity. (small soup)
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