In accordance with the Notice of the General Office of the National Development and Reform Commission on Continued Organization and Implementation of Special Issues Concerning the Specialization of Electronic Special Equipment, New Electronic Components and Materials Industrialization (Development and Reform Office Gaoji [2007] No. 3036), the National Development and Reform Commission The application for the project was reviewed. According to the “Interim Measures for the Administration of National High-tech Industry Development Projectsâ€, it was agreed that the high-brightness chip LED industrialization project for LCD backlights of Jiangxi Lianchuang Optoelectronics Technology Co., Ltd. was included in the electronic special equipment. , new electronic components and materials industrialization special.
Agree to Wuhan Diyuan Optoelectronics Technology Co., Ltd. Semiconductor lighting GaN-based LED high-power epitaxial wafer and chip industrialization project is included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed to Xinxiang City Shenzhou Crystal Technology Development Co., Ltd. High-brightness LED GaAs single-chip industrialization project included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed to Anhui Ganzheng Optoelectronics Co., Ltd. annual high-power LED industrialization project included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed that Hisense Group Co., Ltd. large-size LED-backlit TV LCD module industrialization project was included in the new flat panel display device industrialization project.
Agreed to Xiamen Hualian Electronics Co., Ltd. TOP type LED packaging and application products industrialization project included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed to Xiamen Ganzhao Photoelectric Co., Ltd. Power Quaternary LED Chip Industrialization Project
Agree to Wuhan Diyuan Optoelectronics Technology Co., Ltd. Semiconductor lighting GaN-based LED high-power epitaxial wafer and chip industrialization project is included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed to Xinxiang City Shenzhou Crystal Technology Development Co., Ltd. High-brightness LED GaAs single-chip industrialization project included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed to Anhui Ganzheng Optoelectronics Co., Ltd. annual high-power LED industrialization project included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed that Hisense Group Co., Ltd. large-size LED-backlit TV LCD module industrialization project was included in the new flat panel display device industrialization project.
Agreed to Xiamen Hualian Electronics Co., Ltd. TOP type LED packaging and application products industrialization project included in the special equipment for electronic equipment, new electronic components and materials industrialization.
Agreed to Xiamen Ganzhao Photoelectric Co., Ltd. Power Quaternary LED Chip Industrialization Project
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