The iPhone 6s Plus released by Apple this year has become the biggest and most important part of the iPhone since the past generation. Today we have also dismantled the iPhone 6s Plus.
Before disassembling, let's take a look at what highlights the iPhone 6s Plus:
Apple A9 processor and M9 assisted processor
16, 64 or 128 GB ROM
5.5" 1920x1080 pixel (401 PPI) retina screen, 3D Touch
Front 500W HD camera, rear 1200W iSight camera, support 4K video recording, support optical image stabilization
7000 series aluminum alloy casing, Lon-X glass
Support 802.11a/b/g/n/ac wireless applications, Bluetooth 4.2, NFC, 23 LTE bands
Taptic Engine feedback motor
The iPhone 6s Plus rear panel has a large "S" shape, and the outer casing is made of 7000 series aluminum alloy. The composition of this material is professionally analyzed: 91.17% aluminum, 0.08% iron, 7.64% zinc and 0.106% tungsten.
X-ray perspective is taken before disassembly.
As with the iPhone 6s, first remove the two fixing screws at the bottom with a screwdriver.
Separate the iPhone 6s Plus front and rear panels with the suction cup tool.
Remove the metal shield that secures the battery cable by unscrewing the screw.
Use a crowbar to pick up the battery cable.
Use a crowbar to remove the three cables connecting the front and rear panels.
The weight of the iPhone 6s Plus front panel is 80g, which is a full increase of 33% compared to the previous 60g. It is obvious that Apple will increase the weight for 3D Touch.
Compared with the iPhone 6s, the iPhone 6s Plus's Taptic Engine feedback motor is much smaller.
Remove the adhesive from the bottom of the battery.
Remove the battery.
The battery capacity is 2750mAh, which is 165mAh less than the previous generation.
We can take the camera off by pulling the cable.
Take a 6s camera to compare it. The camera on the left is 6s and the camera on the right is Plus. The shape of the two is basically the same, the position of the cable is the same, but the camera of Plus is obviously larger.
Let's take a closer look at the Plus 1200W camera with optical image stabilization. The optical anti-shake component added by Plus can be seen from the opening around the lens.
Prepare to remove the motherboard. A little different from the iPhone 6s, Plus has a coaxial cable on the back of the motherboard, please be careful to disassemble.
Open the coaxial cable.
Now you can take the motherboard off.
The chip on the front of the motherboard:
Red: Apple A9 APL1022 SoC and SK Hynix LPDDR4 RAM H9HKNNNBTUMUMR-NLH
Orange: Qualcomm MDM9635M LTE Cat.6 chip
Yellow: Super group TQF6405 power amplifier
Green: Sijia News SKY77812 power amplifier
Light blue: Anwara AFEM-8030 power amplifier
Dark blue: Qualcomm QFE1000 envelope tracking IC
Purple: Ying Meisheng 6-axis gyroscope and acceleration sensor integrated chip
The chip on the reverse side of the motherboard:
Red: Hynix H230DG8UD1ACS 16 GB NAND flash
Orange: General Science Industry 339S00043 Wi-Fi Module
Yellow: NXP NFC 66V10
Green: Apple / Dialog 338S00122 Power Management IC
Light Blue: Apple/Cirrus Logic 338S00105 Audio IC
Dark Blue: Qualcomm PMD9635 Power Management IC
Purple: Sijia News SKY77357 Power Amplifier
Red: Murata 240 front end module
Orange: RF Micro Devices RF5150 Antenna Switch
Yellow: NXP 1610A3
Green: Apple / Cirrus Logic 338S1285 Audio IC
Light Blue: Texas Instruments TPS65730A0P Power Management IC
Dark blue: Qualcomm WTR3925 wireless transceiver chip
Pink: Sijia News SKY13701 cellular and GPS receiver filter module
Black: Texas Instruments TI 57A5KXI
Remove the speaker and cable.
Plus's speakers are very similar to the iPhone 6s, but with some simple modifications in appearance.
Remove the small board and cable, the small board integrates the Lightning interface component.
Similar to the iPhone 6s, there is also a microphone at the bottom of the Plus.
This highly integrated design saves space, but the side effect is that any part of the damage is worse than the whole small board.
Finally, a family portrait, our dismantling to this is all completed. The iPhone 6s Plus has a 7-point repair rating (10 is the easiest to fix). In addition to the complex and difficult to repair Touch ID and motherboard, other parts are easier to repair.
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