High-speed transmission technology market trend analysis

As information technology moves towards high-definition audio and video, high-speed mobile networks and other digital applications, and the recent rise of cloud computing, the entire information industry has created hundreds of MB or even GB from computers, products to infrastructure. The digital file data stream, and the current USB 2.0 peripheral device transfers and copies this type of data, which often takes minutes or even tens of minutes, which makes users very impatient. Therefore, such as USB 3.0, SATA 6Gbps, PCIe 3.0 and even Thunderbolt (10Gbps ) High-speed transmission technology came into being, and even changed the appearance of the display that could only be transmitted through a dedicated cable such as HDMI and Display Port interface.

The Universal Serial Bus (USB) specification has appeared since 1996 and has been in existence for 15 years. The USB 3.0 developed in November 2008 is backward compatible with USB 2.0 / 1.1 devices. The SDP line with embedded optical fiber achieves 5Gbps full-duplex bidirectional transmission performance. 25GB of HD high-quality video can be copied in only 70 seconds; USB 3.0 can also provide 900mA power supply, which can also supply all kinds of PC peripheral storage today Devices, even low-power LCDs. In addition, as AMD's Hudson D3 chipset in the second half of 2011 and the Ivt Bridge platform in the first quarter of 2012 will integrate native USB 3.0 port functions, it is expected that USB 3.0 will be fully supported as a standard specification in 2011.

At present, USB 3.0 chips can be roughly classified as follows: 1. Host chip (Host), which connects the Southbridge chip to the motherboard, provides the external USB port connection capability of the desktop or notebook. Taiwanese developers include asmedia, Yuchuang, Weifeng, etc. 2. Hub / Tab chip (Hub), used to manufacture 1 to 2 or 1 to 4 USB 3.0 hub tap, or integrated on the front panel of the desktop, LCD screen or dock expansion. 3. Device end chip (Device). At present, it is focused on the flash memory control chip of U disk and the USB bridge chip for external hard disk. Taiwanese manufacturers include Xiangshuo, Yuchuang, Weifeng, Wangjiu, Yincan and Chuangwei. 4. Re-driver chip (Re-Driver), used for motherboard or hub, can extend the cable compatibility with the device.

The USB 3.0 to SATAIII bridge chip rammed the S ATA3 specification. In May 2009, it improved NCQ and increased the priority of data transmission. The transmission rate doubled to 6Gb / s, which can help high-performance SSD to break through the performance bottleneck of 300MB / s. It also provides new form connectors such as 7mm ultra-thin optical drive and microSATA with 1.8-inch hard disk / SSD. At the end of 2010, Taiwan ’s three major board manufacturers, such as Asus / Gigabyte / MSI, have launched a large number of motherboards that support SATA3. In addition, in 2011, Intel ’s 2nd generation Core i processor platform Cougar Point (P67 / H67) PCH chip has native support SATA3 specification, SATA3 is expected to become the mainstream specification in the market in 2011. At present, Taiwan factory USB 3.0 to SATA3 bridge chips include Yincan IS621, Xiangshuo AS1051E, Weifeng VL710 chips, etc .; subsequent manufacturers will launch 2/4 port USB3 to SATA3 bridge chips.

Application of audio / video via USB

The concept of audio / video over USB (Audio / Video Over USB) is to directly transmit audio and video data to the tapped AV audio-visual device through the USB Hub for multi-screen display or playback. Especially with USB 3.0's 5Gbps transmission rate and full-duplex, point-to-point characteristics, it is enough to play 1,920x1,080 @ 60Hz Full HD high-definition movies in real time, or 100 channels of HD high-definition (720x480 @ 60Hz) audio and video data strings flow. And each device will not interfere with each other, and there is no situation of sharing bandwidth or delaying waiting. The USB AV application can not only achieve multi-screen display, micro projector / projector projection, but also simplify the design of the screen power cord, because it can be powered by the USB 3.0 cable; the mobile phone can also be connected by the USB 3.0 cable , Connect the mobile phone screen to the large-size LCD screen to enlarge the display, to achieve the convenience of portable content and mobile content. At present, both Yuan Chang and Wei Feng have launched bridge chips using USB display. And USB IF is developing the relevant AV device class (USB AV Devcie Class) for the audio and video application of USB 3.0.

Ultra-compact computer under cloud computing

With the help of USB 3.0 multi-port Hub and integrated Gbps Ethernet network function, it is no longer just a traditional USB 3.0 Hub, but the zero terminal concept (Zero Client) advocated in the Microsoft cloud computing environment: as long as one A computer host with powerful computing functions is connected to such a zero-type terminal (USB 3.0 Hub + GbE). With the Windows MulTIPoint Server 2010 operating system, the Zero Client is connected to a monitor, USB keyboard and USB 3.0 display. Mouse, every user can share and share this computing computer host through the USB monitor and USB mouse / keyboard in front of him, in a multi-person sharing way, through USB 3.0 to transfer information. This can save a lot of information equipment investment. At present, the original Chang Technology has provided solutions to construct such Zero Client.

PCI Express 3.0 trends

Because the PCI Express 3.0 specification was delayed for one year from the original schedule, it was finalized in November last year (2010). As a result, PCIe 3.0 products are currently concentrated on upstream developers ’oscilloscopes, logic analyzers, and other products, but there are still Xiangxiang Shuo, NXP, etc. introduced PCI Express 3.0 high-speed switch / multiplexer.

As for the products that are most likely to use PCIe 3.0 8Gbps bandwidth, they are high-end graphics cards. GPU leaders AMD or NVIDIA are bound to be absent. It is expected that at the Taipei Computer Show in June 2011, we will see PCIe 3.0 8Gbps x16 high-end The initial engineering samples of the graphics card, but the official time to market will be after the third or fourth season of 2011, plus the timetable for the native support for the PCIe 3.0 chipset platform is uncertain. It is expected that it will not be obvious until 2013. Market growth.

Be the first to master the right to speak in specifications and take advantage of Greater China / Global Consumer AV Network and Cloud Business Opportunities

According to statistics from market research institutes, the overall USB 3.0 chip installed capacity exceeded 20 million in 2010, and it is expected to reach more than 100 million in 2011. In 2012 and 2013, high shipments of 370 million and 1 billion, respectively, can be achieved. It proves that the market demand for various USB 3.0 peripheral products brings abundant business opportunities for relevant manufacturers. But whether it will repeat the same mistakes as the past USB 2.0 chip killing war. In the current 2011 1Q market, the USB 3.0 main control chip price has fallen to US $ 3.5, which deserves our close attention.

Fortunately, in this high-speed transmission technology forum, we saw that Taiwanese IC design factories frequently exerted their creativity, as well as efforts to balance time, material cost, and product cost performance. Many control chips and innovative functions (such as 4-port, USB 2.0 hardware Acceleration) are all developed by Taiwanese IC design factories. In the face of the Red Sea (price competition) or the creation of the Blue Ocean (development of innovative applications), they all present a world-class level.

It is hoped that Taiwanese IC design companies can grasp the advantages of Taiwan's wafer foundry upstream and downstream industry supply chain, not only to closely follow the specifications, but to actively enter USB-IF, PCI-SIG, VESA, HDMI, Wireless USB and other forum organizations to dominate the next-generation high-speed transmission technology and seize the right to make specifications The industry will definitely have better results.

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