Thermal conductive material

With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller. At the same time, the computing speed is getting faster and faster, and the heat generation is also getting larger and larger. For example, the maximum heat generated by the Intel processor 3.6G Pentium 4 Ultimate Edition runs. Up to 115W, which puts higher requirements on the heat dissipation of the chip. Designers must use advanced heat-dissipating technology and excellent heat-dissipating materials to effectively take away heat and ensure that the chip can work normally within the maximum temperature that can be tolerated by the chip. The appearance of electronic devices and terminals is increasingly demanding thin and small development. Televisions have evolved from CRTs to LCD flat panel TVs, desktop computers to notebook computers, digital set-top boxes, portable CDs, etc. The design of heat dissipation is different from the traditional forms because of this. The product is relatively thin.

Statistics show that for every 2 degrees increase in temperature of electronic components, the reliability is reduced by 10%; the lifetime of a temperature rise of 50 degrees is only 1/6 of the temperature rise of 25 degrees. The temperature is the most important factor affecting the reliability of equipment. This requires technical measures to limit the temperature rise of the chassis and components. This is thermal design. The principle of thermal design is to reduce the amount of heat, that is, to select better control methods and technologies, such as phase shift control technology and synchronous rectification technology. In addition, low-power devices are used to reduce the number of heat-generating devices. The width of the rough printed lines increases the efficiency of the power supply. The second is to enhance heat dissipation, which uses heat transfer, radiation and convection to transfer heat.

However, for products with a flat appearance, first of all, from the standpoint of space, it is not possible to use more heat-dissipating aluminum sheets and fans. Overall, it is not allowed to enhance the design of cooling-type cooling, and convection cannot be used. Radiating heat is also difficult to achieve in a flat space. Therefore, we all thought that the use of chassis heat dissipation, the benefit is not to consider fan plus fan power supply, will not cause more dust due to the fan, there is no noise caused by the fan.

How can we really use the heat of the machine shell? The opportunity for the application of flexible silicone thermal insulation material comes. Soft thermal insulation silicone insulation pad is a kind of heat transfer interface material, is a sheet material, can be arbitrarily cut according to the size and shape of the heating power device, has good thermal conductivity and insulation properties, its role is to fill the heat power device The gap between the heat sink and the heat sink is the best product to replace the binary heat dissipation system of the thermal grease and the mica sheet (insulating material). The product's thermal conductivity is 2.45W/mK, while the air's thermal conductivity is 0.03w/mk; the voltage breakdown value is above 4000V, and it can be used in most electronic devices with insulation requirements. Process thickness varies from 0.5mm to 5mm, each 0.5mm plus one, that is, 0.5mm 1mm 1.5mm 2mm up to 5mm, special requirements can be increased to 10mm, the thickness is different for the designer to facilitate the choice of PCB board and heat power device s position. Flame retardant performance meets UL 94V-0 requirements and meets EU SGS environmental certification. Operating temperature is generally -50°C to 220°C. Therefore, it is a very good thermal conductive material. In addition, it is particularly soft and specially designed for heat transfer using gaps. It can fill gaps, complete heat transfer at heat-generating sites and heat-dissipation sites, increase heat transfer area, and function as a shock-absorbing insulator and sealer. The ultra-thin design requirements are new materials that are extremely process-oriented and user-friendly. With a wide range of thicknesses, it is particularly suitable for use in automotive, display, computer and power electronics.