First, the determination of the NC machining sequence (1) the principle of coarse and fine first (2) advanced and far processing, the principle of reducing the idle travel time (3) the principle of internal and external crossover (4) the principle of the basic principle of the base 2, the choice of cutting amount (1 The determination of the amount of the knife to be eaten (2) the feed rate (3) the determination of the spindle speed 3. The content and steps of the NC programming
(1) Analyze the part pattern, determine the machining process; numerical calculation; write the part processing program list; input program/transfer program; program check, first piece trial cut.
Fourth, numerical control programming methods (1) manual programming (2) automatic programming five, numerical control programming mode (1) incremental programming (2) absolute value programming (3) mixed programming six, numerical control programming program format (1) program No. (2) Program content (3) Program end instruction 7. G code is divided into modal code and non-modal code. Modal means that the code is specified in one program until it appears another code of the same group. Non-modal code is only valid in programs that have this code written.
Eight, the meaning of the various instructions of the G code:
G00 fast moving point positioning, G01 linear interpolation, G02 clockwise circular interpolation, G03 counterclockwise circular interpolation, G04 pause, G17 XY plane selection, G18 ZX plane selection, G19 YZ plane selection, G32 thread cutting, G40 Tool compensation cancellation, G41 tool compensation - left, G42 tool compensation - right, G43 tool length compensation - positive, G44 tool length compensation - left, G49 tool length compensation logout, G50 spindle maximum speed limit, G54-G59 processing Coordinate system setting, G65 user macro, G70 finishing cycle, G71 outer circle rough cutting cycle, G72 end rough cutting cycle, G73 closed cutting cycle, G74 deep hole drilling cycle, G76 composite thread cutting cycle, G80 cancel fixed cycle, G81 fixed point drilling cycle, G90 absolute value programming, G91 incremental value programming, G92 thread cutting cycle, G94 feed per minute, G95 feed per revolution, G96 constant line speed control, G97 constant line speed cancellation, G98 return Starting plane, G99 returns to the R plane.
Nine, M code
M00 program stops, M01 stops, M02 program stops, M03 spindle rotates clockwise, M04 spindle rotates counterclockwise, M05 spindle rotates stop, M06 changes tool, M07 No. 2 cutting fluid opens, M01 No. 1 cutting fluid opens, M09 cutting fluid Off, the M30 program stops and returns to the beginning, M98 calls the subroutine, and M99 returns to the main program.
10. The coordinate system on the CNC machine tool adopts the right-handed Cartesian coordinate system. The direction of the thumb is the positive direction of the X-axis, the index finger is the positive direction of the Y-axis, and the ring finger is the positive direction of the Z-axis.
XI. Principle of following the workpiece coordinate system (1) The workpiece origin is selected on the design basis or process basis of the workpiece pattern to facilitate programming;
(2) The workpiece origin is selected as much as possible on the surface of the workpiece with high dimensional accuracy and low surface roughness;
(3) The origin of the workpiece is preferably selected on the center of symmetry of the workpiece;
(4) To facilitate measurement and verification.
Twelve, the commonly used method of tool setting is "try cutting the knife"
Thirteen, the principle of selection of the knife point (1) The selected tool point should make the programming simple;
(2) The tool point should be selected in a position that is easy to find and easy to determine the origin of the part processing;
(3) The tool point should be selected in a convenient and reliable position during the processing;
(4) The selection of the tool point should be beneficial to improve the machining accuracy.
The figures indicated by the numbers after F are mm/min and mm/r. For the lathe, G98 means mm/min, G99 means mm/r, for milling machine G94, mm/min, and G95 means mm/r.
Fifteen, the tool nose arc radius automatic compensation function is divided into three steps (1) to establish tool compensation (2) for tool compensation (3) to cancel tool compensation sixteen, the tool nose arc radius automatic compensation considerations (1 The setting and canceling of the automatic adjustment of the tool nose arc radius should not be implemented on the G02, G03 command circular path program;
(2) When the tool nose arc radius is automatically compensated for setting and canceling, the change of the tool position is a gradual process;
(3) When the input tool data is a negative value, the G41 and G42 commands are mutually converted;
(4) Do not repeat the G41 and G42 instructions, otherwise a special kind of compensation will be generated.
17. What is constant line speed turning? What should I pay special attention to when using constant line speed turning?
A: Constant line speed cutting is also called fixed line speed cutting. Its meaning is that when turning non-cylindrical inner and outer diameters, the spindle speed of the material can be continuously changed to keep the cutting line speed of the real-time cutting position constant (constant). . Note that the maximum speed should generally be limited before using this function. If the tool is to travel very close to the center of rotation of the workpiece, the maximum speed must be limited before the constant speed command, otherwise a “flying†will occur.
18. When arc machining, R is the specified arc radius. When the central angle of the arc is ≤180 degrees, the R value is positive, and vice versa.
Nineteen, CNC milling machines often use the following process methods:
(1) several sorting methods of tools;
(2) coarse and fine processing method;
(3) Processing part sorting method.
Twenty, CNC milling adopts the method of centralized operation, usually according to the principle of “from simple to complexâ€, first processing planes, grooves, holes, processing inner cavity, shape, final machining surface, and processing surface with low precision requirement first. , the part with higher processing precision.
Twenty-one, the problems that should be paid attention to when arranging the CNC milling process:
(1) The processing of the previous process cannot affect the positioning and clamping of the next process, and the intermediate machining process must be considered in the middle;
(2) Generally, the inner shape and inner cavity processing steps are performed first, and then the outer shape processing step is performed;
(3) It is best to continue the process of the same positioning, clamping or the same tool to reduce the number of repeated positioning and the number of tool changes;
(4) In the multiple processes carried out in the same installation, the process of less rigid damage to the workpiece should be arranged first.
Twenty-two, classification of fixtures: (1) general fixtures;
(2) special fixtures;
(3) group fixtures;
(4) Combination fixture.
Twenty-three, the cutting amount of milling processing includes cutting speed, feed rate, the amount of knife to be eaten and the amount of side knife.
24. The machine coordinate system is the coordinate system set by the manufacturer on the machine tool. The origin is a fixed point on the machine tool.
Twenty-five, the difference between G92 and G54--G59 instructions: G92 command and G54--G59 command are used to set the workpiece machining coordinate system, but there are differences in the use process. The G92 command is used to set and select the machining coordinate system. The origin of the machining coordinate system set is related to the position of the current tool. The position of this machining origin in the machine coordinate system is the current tool position. The difference is different.
Twenty-six, the G17 command represents the XY plane, the G18 command represents the ZX plane, and the G19 command represents the YZ plane.
Twenty-seven, down milling: tool machining and workpiece rotation direction are the same, single-side cutting, low efficiency, suitable for finishing, up-cut: tool machining and workpiece rotation direction is opposite, double-sided cutting, suitable for rough machining, high efficiency.
Twenty-eight, G28 command is used to quickly return the reference point to the tool through the specified intermediate point.
Twenty-nine, X, Y, Z in the scaling instruction G51 is the coordinate value of the zoom center, and P is followed by the zoom factor.
30. Precautions for determining the workpiece positioning and clamping scheme;
(1) Strive to unify the design basis, process reference and programming origin to reduce the reference misalignment error and the computational workload in NC programming;
(2) Try to reduce the number of clamping, as far as possible in one positioning and clamping, can process all or most of the surface to be processed on the workpiece to reduce the clamping error, improve the mutual positional accuracy between the machining surfaces, and give full play to The efficiency of CNC machine tools;
(3) Avoid using the manual adjustment scheme to avoid excessive machine time and affect processing efficiency.
Thirty-one, macro G65, this instruction can realize rich macro functions, including arithmetic operations, logic operations and other processing functions.
HDI Printed Circuit Boards - High Density Interconnect PCB Technology
With the development of society, the progress of technology comes from people's constant pursuit of life and their yearning for higher quality of life. Personal consumer electronic products such as notebook computers, personal computers and mobile phones require lighter weight and smaller volume, while smaller volume requires smaller design accuracy and higher density. At the same time, the quality and speed of interconnection technology should be better. This requires designers who make these products to design better components to improve electrical performance, such as circuit boards and so on.
In order to manufacture PCB products of this kind, PCB manufacturers need more advanced manufacturing technology. Of course, from the point of view of product cost, it needs lower cost. This seems contradictory, but HDI PCB can solve this problem very well. HDI PCB has numerous advantages, such as high speed, small size and high frequency.
HDI PCB is the better option for high-layer count and costly laminated boards.
What is a HDI PCB, The definition of HDI PCB
HDI stands for High Density Interconnector, HDI Printed Circuit Board. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment.
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
There were a lot of different names for the PCB with such structures. For example, it was called SBU (Sequence Build up the Process) in European and American industry as the program production is in the constructive mode of sequence. It was called MVP (Microvia Process) in Japanese industry because the hole of such products is much smaller than the previous one. It was also called BUM (Build up Multilayer PCB Board) because the traditional multilayer is known as MLB (Multilayer PCB Board).In order to avoid confusion, IPC Printed Circuit Association proposed to call it HDI (High Density Interconnection Technology) as the common name, but it can not reflect the characteristics of the circuit board. So the majority in the PCB industry define such products as HDI PCB.
Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.
HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.
HDI PCBs are described by high-density features comprising of laser micro-vias, high performance thin materials and fine lines. The better density allows extra functions per unit area. These types of multifaceted structures give the required routing resolution for large pin-count chips which are used in mobile devices and other high technology products.
The placement of the parts on the circuit board needs extra precision than conservative board design due to miniature pads and fine pitch of the circuitry on the circuit board. Leadless chips require special soldering methods and additional steps in the assembly and repair process.
The lesser weight and size of the HDI circuitry means the PCBs fit into the little spaces and have a smaller amount of mass than conservative PCB designs. The smaller weight and size even signifies that there is lesser chance of harm from mechanical shocks.
Consumer Driven Technology
The via-in-pad process supports more technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.
HDI Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.
HDI PCB Types
According to layer up different, currently DHI board is divided into three basic types:
1) HDI PCB (1+N+1)
Features:
- Suitable for BGA with lower I/O counts
- Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
- Qualified material and surface treatment for Lead-free process
- Excellent mounting stability and reliability
- Copper filled via
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card
1+N+1 HDI PCB Structure:
2) HDI PCB (2+N+2)
Features:
- Suitable for BGA with smaller ball pitch and higher I/O counts
- Increase routing density in complicated design
- Thin board capabilities
- Lower Dk / Df material enables better signal transmission performance
- Copper filled via
2+N+2 HDI PCB Structure:
3) ELIC (Every Layer Interconnection)
Features:
- Every layer via structure maximizes design freedom
- Copper filled via provides better reliability
- Superior electrical characteristics
- Cu bump and metal paste technologies for very thin board
Every Layer Interconnection Structure:
JHY PCB' HDI PCB Capabilities
HDI PCB manufacturing requires an advanced level of technical expertise and the latest state-of-the-art equipment for exacting precision.
JHY PCB offer solutions for low-volume/high-mix PCB manufacturing on a quickturn basis, as well as production quantities and high-tech capabilities for advanced builds with demanding requirements for aerospace, defense, medical, and commercial applications. Capabilities include:
HDI Structures |
Type of Micro vias |
Mass Production |
Small-Middle Batch |
Prototype | Available |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 |
Blind/Buried staggered vias |
Yes | Yes | Yes | 6 layers+ |
2+N+2 |
Blind/Buried stacked vias |
Yes | Yes | Yes | 6 layers+ |
3+N+3 |
Blind/Buried staggered vias |
/ | Yes | Yes | 8 layers+ |
3+N+3 |
Blind/Buried stacked vias |
/ | / | Yes | 8 layers+ |
Check our HDI PCB capabilities by reviewing the table found below:
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 4 - 24layers |
Order Quantity | 1pc - 10000+pcs |
Build Time | 2days - 5weeks |
Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm - 3.0mm |
Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 2.5mil/2.5mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish |
HASL - Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickle/Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP - Organic Solderability Preservatives - RoHS |
Min Annular Ring | 4mil, 3mil - laser drill |
Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
Other Techniques |
Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²) |
Benefits of HDI PCB Technology with Micro Circuits:
The evolution of high-density PCB technology has given engineers greater design freedom and flexibility than ever before. Designers using HDI high density interconnect methods now can place more components on both sides of the raw PCB if desired. In essence, an HDI PCB gives designers more space to work with, while allowing them to place smaller components even closer together. This means that a high-density interconnect PCB ultimately results in faster signal transmission along with enhanced signal quality.
HDI PCB is widely used to reduce the weight and overall dimensions of products, as well as to enhance the electrical performance of the device. The high-density PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras and 4G network communications. The HDI PCB is also prominently featured in medical devices, as well as various electronic aircraft parts and components. The possibilities for high-density interconnect PCB technology seem almost limitless.
- Shorter PCB manufacturing lead times and improved device performance for Flip Chip, BGA, MCM, SIP technologies and medical devices.
- Allows utilization of technologies that require ultra thin cores, fine line geometries and alternative via technologies for enhanced thermal transfer in the case of a thermal PCB.
- Allows utilization of the technologies that require 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.
- Allows reducing the [time to market" equation by combining the process capabilities with a strong comprehension of high speed digital and high frequency RF PCB package requirements.
- Increases the area for the PCB designer provider to place circuit components as the components are decreased in size and spaced much closer together. This also improves faster signal transmission and reduced signal loss.
HDI PCB Applications
HDI PCBs are appropriate for a wide range of industries. As mentioned above, you'll find them in all types of digital devices, like smartphones and tablets, where miniaturization is key to the effective application of the product. You can also find high-density interconnect PCBs in automobiles, aircraft and other vehicles that rely on electronics.
One of the most critical areas where the high-density PCB is making huge inroads is in the medical arena. Medical devices frequently need small packages with high transmission rates that only HDI PCBs can supply.
For example, an implant needs to be small enough to fit in the human body, but any electronics involved in that implant absolutely must efficiently allow for high-speed signal transmission. Here, the HDI PCB indeed is a godsend. HDI PCBs can also be useful in other medical equipment, like emergency room monitors, CT scans and much more.
No matter your industry, you're probably already getting some ideas about how high-density interconnect PCBs can make the electronics you produce or use even better - get in touch with us PCBCart to discuss it. We'll let you know if you're on the right track and help you decide exactly how beneficial an HDI PCB can be to your industry. Then, you can determine whether or not to take the next step.
High Density PCBs of Impeccable Quality manufacturer
Over the course of a decade in business, JHY PCB has established a hard-earned reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without min order quantity requirement. Our team run design for manufacture check on your custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your performance requirements. We also have an on-site quality control department to verify the finished product meet your high quality standards.
Laser Drill & Laser Direct Imaging: Technology for High Quality HDI PCB Manufacturing.
HDI PCB designs push the limits of technology and JHY PCB is at the forefront of innovation, satisfying the most rigorous requirements.
The demand for HDI PCB manufacturing has been increasing due to the advancements in technology and the many benefits HDI PCBs provide for high-tech applications. Fitting more technology in less space with fewer layers creates limitations for many PCB manufacturers that do not have the specialized equipment and the capacity for advanced features, finer lines, and tighter tolerances.
HDI printed circuit board designs utilize a combination of advanced features like microvias, blind vias, via-in-pad, along with stacked and staggered vias to maximize the the space of the board while increasing its performance and functionality.
JHY PCB achieves high quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.
Advanced PCB Materials for HDI PCB Fabrication
JHY PCB offers vast material options for different applications from top manufacturers, such as Isola, Nelco, Arlon, Rogers, and Taconic. Our laminate options offer advanced properties that include:
- High Thermal Reliability
- Ultra-Low Loss
- High Speed Digital
- Halogen-Free
- RoHS Compliant
- Lead-Free High Tg HDI Printed Circuit BoardHDI Printed Circuit BoardHDI Printed Circuit Boards
Additional informations
What is an HDI stackup in Multilayer PCB Design?
Electronic PCB Board,HDI PCB,HDI Printed Circuit Board,HDI Circuit Board
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