The "new" word is the core feature of the LED market, more specifically "new technologies, new products, new businesses." China has become a market for global LED packaging manufacturers. Various international manufacturers are accelerating the rush to eat this piece of cake, while China's local excellent manufacturers also maintain a high-speed development trend, and the industrial concentration will gradually increase as the speed of consolidation increases.
Although China has become the world's largest LED application market, its development in the high-end sector is still relatively lagging behind. At this stage, the core technology of high-end LED packaging materials is basically in the hands of European and American enterprises. Most domestic enterprises are at the low end of the industry, and it is difficult to gain the upper hand in competition with foreign companies. Moreover, in some areas, the homogenization competition is becoming increasingly fierce, and the phenomenon of subtle charging and malicious price cuts disrupting the market order further weakens the competitiveness of the domestic market, thus limiting the rapid development of the domestic LED packaging industry.
In this situation, only LED packaging technology can be continuously developed, in order to drive the development of China's LED upstream and downstream enterprises.
When it comes to packaging technology, we have to talk about flip-chip LED technology. At present, the packaging structure is undergoing changes, and more and more LED companies are transforming the packaging form to improve the production efficiency, shorten the production cycle and reduce the production cost. Among them, the advantages of the flip-chip package form are more obvious.
According to Yuan Yikai, director of National Star Optoelectronics R&D Center, the core advantages of flip-chip package form are mainly reflected in the following four aspects: 1. The active layer is closer to the substrate, shortening the heat flow path from the heat source to the substrate, and having lower thermal resistance. 2, suitable for high current drive, higher light efficiency; 3, superior reliability, can improve product life, reduce product maintenance costs; 4, size can be smaller, optical is easier to match.
“As the market demand for LED light source is gradually increasing, everyone is increasingly pursuing high quality, high light efficiency and high cost performance, and the emergence of flip-chip light source caters to the market demand. Flip-chip LED is the development trend in the next few years.†Qu Junyi, chairman of Yangyang, said.
Flip the complete replacement of the dress still pending verification
As we all know, in recent years, everyone has been comparing flip-chips with formal wear, and even the industry has repeatedly reported that flip-chips are the inevitable trend, but for the moment, the market is still dominated by formal wear. Whether flipping can really replace it, the industry has different opinions.
Flip-chip is a new package structure compared to formal decoration. The product can be applied to the field of LED lighting, such as home lighting, commercial lighting, outdoor road lighting, factory lighting, etc. Yin Xiaopeng, deputy general manager of Liyang Co., Ltd., said that in the medium and long term, flip-chip will occupy an absolutely large proportion of the market, and it is an inevitable trend to replace formal wear as the mainstream. However, from the feedback information on the market, the recognition of the flip-chip market is not enough. There is still a long way to go to completely replace the formal wear.
For COB products, the comparison between flip-chip COB and formal COB has never been interrupted. Zheng Haibin, deputy general manager of Zhaochi Energy-saving Lighting, believes that some COB products are relatively mature and the cost is relatively low, but the flip-chip COB gives full play to the chip's resistance to higher current and no gold wire production, optimizing material cost and reducing production management costs. The conditions are provided, so the full application of flip-chip COB is just a matter of waiting for market validation.
Of course, some people in the industry think that there is not much advantage in flip-chip comparison. Because the secondary optics of the flip-chip is not properly fitted, the brightness is not high enough, the price difference is not large, etc. These factors all lead to the market recognition of the flip-chip is not high enough.
In fact, as far as technology is concerned, flipping does solve a lot of problems. For example, flip-chip non-gold wire package solves problems such as non-lighting and flicker caused by gold wire soldering or poor contact; flip-chip soldering technology improves heat dissipation capability, improves product current surge stability, and improves product life; The installation and use process is faster and more convenient, avoiding quality problems or hidden dangers caused by installation. Perhaps, with the continuous development of flip-chip technology, the flip-chip market will become increasingly clear in the near future.
Flip-chip LED popularity still has difficulties
Any market needs to be cultivated, and end users need a time dimension to test both in terms of professionalism and trust in new products. To some extent, flip-chip products still need to spend more energy on production processes, manufacturing costs, product efficacy, and publicity.
"Although flip-chip LED technology is gradually sought after by the industry, there are still many packaging manufacturers who are still waiting to see the investment in equipment, technical research, market acceptance, etc. Nowadays, only medium and large-scale packaging manufacturers In the intervention layout." Yin Xiaopeng told Gaogong LED.
It must be said that due to the attitude of packaging manufacturers, the popularity of flip-chip LEDs faces no small challenge. For the popularity of flip-chip LEDs, Yuan Yikai believes that there are three main difficulties:
First, the limitations of the packaging process. The active layer of the chip faces downward, and in the process of chip preparation and packaging, if the process is improperly processed, it is easy to cause large stress damage;
Second, the flip-chip technology currently has greater advantages in high-power products and integrated packaging. In the application of small and medium power, the cost competitiveness is not very strong;
Third, the flip-chip has higher requirements on equipment, high equipment purchase cost, complicated process, and high defect rate of finished products.
Wang Mengyuan, general manager of Zhonghao Optoelectronics added that the cost of flip-chip products is high and the luminous flux is low. Moreover, the dressing technology and process are more mature and the efficiency is higher. The flip-chip process control is difficult, and the problem of large voids in individual locations is easy to occur. .
In view of the above various problems, the popularity of flip-chip LEDs still has a long way to go.
Difficulties exist objectively, how do companies respond
At present, although the popularity of flip-chip LEDs is still difficult, there are still many packaging companies working hard in this technology field to contribute to the development of flip-chip packaging technology.
As one of the earliest companies in China to carry out research on flip-chip packaging technology, Guoxing Optoelectronics has formed a stable production process, improved yield, reduced production cost and formed a series of high-quality products through several years of accumulation. Semiconductors have introduced different sizes and power flip chips, which are available in volume. Next, Guoxing Optoelectronics will cooperate with National Star Semiconductor to increase the application field of flip chip, especially the development of very small power chips, and strive to make a major breakthrough in the RGB of National Star Optoelectronics.
In view of the difficulties in flip-chip products, Liyang shares cooperation with domestic and foreign brand chip manufacturers to select flip-chips with better performance and better size specifications to further enhance the light efficiency and stability of flip-chip products. Professional flip-chip production equipment, and using 3D solder paste printing, eutectic and other processes, thoroughly improve the drawbacks of traditional welding processes, ensure dead light rate and product stability; through the introduction of the world's leading X-RAY cavity rate testing equipment into the production line , greatly guarantee the quality of the product. In addition, through professional professional flip-chip training, we will strengthen the professional skills of the sales team and actively guide customers to deepen their understanding and acceptance of flip-chip products.
As a high-quality light source manufacturer in the field of semiconductor lighting, Zhonghao Optoelectronics will select different chip configurations according to different customer needs to meet customer needs, and at the same time improve the luminous flux of products through process improvement; in addition, through advanced printing equipment and supporting equipment to enhance The precision of the solder paste ensures the uniformity of the solder paste and perfects the reflow soldering process to ensure the void rate of the product and ensure product reliability.
Of course, there are still many companies that struggle for flip-chip technology innovation. It is believed that under the joint efforts of these enterprises, the "spring" of flip-chip technology is not far away.
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