The LED stage light is a kind of stage Lighting. It is a new type of lamp that uses LED lamp beads as a light source to apply to the stage lighting. It has a classification of stage performance, stage lighting, stage decoration and effects according to the purpose.
The LED stage lights are rich in color, and the red, green and blue colors can mix 16.7 million different colors. Low power, low driving voltage, high luminous efficiency and energy saving. Safe and non-radiative, no UV rays. High life, theoretical life can reach 100,000 hours
The most common color change and color mixing applications for LED stage lights: LED par lights, floodlights, wall washers, commonly used in large stage performances, evening parties, concerts, outdoor performances, urban lighting projects, building decoration, etc. The application of pattern lights, lanterns, magic lights, chrysanthemum lights, most commonly used for indoor performances, entertainment venues, such as bars, discos, dance halls, KTV rooms and so on. The application of decorative effects, light bars, light strips, xenon lights, star curtains, etc., are often used for holiday decoration, building decoration, stage decoration and so on.
1. Chip: Mainly manifested by solder pad contamination, chip damage, chip cutting size, chip cutting tilt. Precautionary measures: Strictly control the incoming inspection and find that the problem requires the supplier to improve.
2. Bracket: The main performance is that the deviation between the size of the crucible and the C dimension is too large, the bracket is discolored and rusted, and the bracket is deformed. Inadequate feeding is a supplier's problem, and suppliers should be informed to improve and strictly control the feed.
3. Silver Glue: Mainly manifested as poor viscosity of silver glue, the use period is exceeded, storage conditions and thawing conditions are inconsistent with actual standards. For the viscosity of silver glue, it is generally not going to be put into production after engineering evaluation, but it is not that the silver glue is the best. If it is found that there is a bad occurrence, it can be evaluated. Other use periods, storage conditions, thawing conditions, etc. are all artificially controlled. As long as the SOP operation is strictly followed, there are generally not many problems.
1. Operators violated regulations: For example, if gloves are not worn, silver glue will be taken directly from the refrigerator without being thawed, and the operator will not work according to SOP, or the machine will be unskilled, which will affect the quality of the solid crystal. Preventive measures: The foreman strengthens the management, the operators work according to the SOP, the quality assurance personnel strengthen the audit, strengthen the education and training for the unskilled personnel of the machine, and the official certificate is not allowed to be officially employed.
2. Maintenance personnel improperly adjusted: The countermeasure is to improve the technical level. For example, the crystal height, the solid crystal height, the thimble height, the setting of some delay time, the motor parameters, the setting of the table parameters, etc., are all adjusted to the optimal state according to the standard.
Third, to ensure that there will be no machine defectsThe machine is mainly represented by some spare parts or mechanical structures of the machine, and the influence of the system and other defects on the quality of the solid crystal. Make sure that the functions of the machine are normal.
Fourth, the implementation of the correct tuning method1. The spot is not right: Counter----Re-calibrate the spot to ensure three points and one line.
2. Improper adjustment of various parameters: for example, kicklevel, bondlevel, ejectorlevel delay time, motor parameters, etc., can be added a few more steps and more steps can be done, but the results are completely different. The same is the height of the thimble. When the chip can't be sucked, some people make the parameters, but they don't consider whether the thimble is blunt or broken. As a result, the chip is damaged and the corner is offset. The matching of the delay time and the motor parameters is also the same. If the matching is not good, the welding arm movement will be different, which also causes abnormal quality.
3. Improper setting of binary value: countermeasures----reset binarization.
4. The standard of machine adjustment is inconsistent: For example, when adjusting the dispensing glue, the dispensing spring is pressed to death, and the dispensing head has no elasticity at all. As a result, it is useless to adjust the parameters. Another example is the adjustment of the claws. If the hooking and popping displacements of the upper and lower hooks are not adjusted according to the standard, it is easy to cause the running materials and the bracket deformation. Another example is the pressure of the welding arm. If it is not adjusted according to the standard, it will also affect the quality of the solid crystal, and it will not be adjusted well with the parameters.
Fifth, master the process1. Whether the cleaning of the silver glue tank is cleaned regularly.
2. Whether the choice of silver glue is reasonable.
3. Whether the operator wears gloves or masks.
4. Baking conditions, time and temperature of the solid crystal material.
LED module cooling function detailed:With the first edition of the LED lighting products and related components safety standard "ANSI/UL 8750" came into effect at the end of 2009, and obtained the American National Standards Agency (American NaTIonal Standar
With the first edition of the LED lighting products and related components safety standard "ANSI/UL 8750" came into effect at the end of 2009, and obtained the American National Standards Institute (ANSI) and the Canadian Standard AssociaTIon (CSA). Accreditation, after becoming the universal standard in North America, has accelerated this change.
The release of safety standards means that the industry has a clearer safety specification to follow, and it has also prompted the LED lighting industry to finally open up a large number of LED lighting products with confidence.
Although LED has the advantage of energy saving, it also has a well-known heat dissipation problem. Compared with traditional lamps, the LED power is low, and the input power is converted into heat energy in large quantities. In addition, in order to obtain high power, multiple parallel uses are often required. The heat sink substrate must provide sufficient heat dissipation.
The choice of materials for the heat-dissipating substrate, which is the key to LED performance, has a great impact on the safety of LED lamps. It is a serious challenge for the industry to consider the considerations of product delay and product safety and heat dissipation.
Through the deconstruction of relevant standards, this paper points out the safety issues that must be paid attention to in the heat dissipation substrate, so that the LED industry has a deeper understanding of the safety design and cost considerations of the heat dissipation substrate, and prepares in advance.
The key to heat dissipation lies in LED die package and substrate design.In addition to high-power LEDs, most LED luminaires must be designed into arrays of different shapes in order to achieve the same brightness as conventional luminaires. In order to meet the control requirements, the best way is to The LED die package is soldered to the board. Since the LED illumination power to the heating power ratio is about 1:4, the matching circuit board must be different with the difference in LED power.
For example, low-power LEDs used in general flashlights or indications, because of the simple circuit and wide spacing, are generally phenolic paper substrates (Paper Phenolic® XPC, FR-1) or glass fiber impregnated epoxy substrates ( Fiberglass reinforced epoxy ∠FR-4) is sufficient to provide mechanical support and to dissipate heat through natural convection of the air for control purposes. In order to achieve high power and high illumination requirements, the increase in heat generation and the increase in circuit arrangement density will make the above substrate unable to provide sufficient heat dissipation capability.
LED lamps have strict requirements for heat dissipation, and must take into account the limited heat dissipation area and insulation between circuits. The substrate design is particularly important. Although the ceramic substrate can meet the requirements of heat dissipation and insulation at the same time, the ceramic substrate is very difficult to manufacture, and its brittleness is not conducive to large-area arrays. The manufacturer has to use the insulating material on the heat-dissipating substrate such as aluminum or iron. The layer structure uses the soldering of the pins to directly transfer the heat of the die package to the heat dissipating material, and even the idea of ​​changing the coating material such as the insulating material or the solder resist ink to the heat dissipating material to achieve better Thermal performance.
Strict heat dissipation requires a cost and safety dilemmaThe safety requirements of the luminaires, like pyramids, through the pre-selection mechanism, the selection of certified materials will reduce the durability test items required for the final product. Therefore, the materials in the LED module must pass the corresponding certification to ensure that the lighting products can be used for a long time without danger.
UL 8750 requires that the LED substrate must have the corresponding board temperature certification and flame resistance rating (listed in UL 796); the organic insulating material or coating material used for the board must also achieve the corresponding long-term use temperature. (or referred to as the Relative Thermal Index, Relative Thermal Index, RTI, listed in UL 746E) and approved for fire resistance rating.
These requirements are affected by the internal temperature of the LED luminaire product when it is actually used: the lower the internal temperature, the lower the temperature rating requirement for the heat dissipating material. However, the degree of heat dissipation depends on the modification of the material. The better the heat dissipation performance, the relatively high price of the material, which makes the industry face a dilemma between cost and safety requirements.
Obtaining market certification materialsThe formulation of the heat dissipating material is mostly confidential or patented. Therefore, the difference in the heat dissipating substrate is very large. There is no way to use the same materials as the FR-1 and FR-4, which are widely used in the industry for a long time, and the versatility and characteristics are widely known. In addition, when obtaining a relative temperature index (RTI) higher than 90 °C, it is necessary to conduct long-term tests for 9 to 18 months or more, and even may not be able to obtain effective results at one time. The situation; together with the approval of the materials, it is necessary to carry out another 2 to 4 months of board production capacity recognition, for various reasons, the situation of long-term lack of material is not uncommon.
At present, there are only a handful of materials that have been approved for temperature resistance of heat-dissipating substrates in the world, and many of them are not large manufacturers. For a list of approved vendors, go to UL's public certification database (http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/index.html).
In addition to the insulating substrate material which has sufficient heat dissipation capability, other intermediate insulating material layers for bonding the copper foil line and the heat dissipating material must be tested for temperature resistance by the combined structure.
According to the standard, all the heat-dissipating insulation materials need to be analyzed for long-term thermal decay such as Dielectric, Tensile Strength, Delamination and Flammability. As for the composite structure combined with the heat-dissipating material, it is necessary to perform dielectric strength, constant-width conductor bond strength and heat-resistant thermal decay analysis.
After obtaining the appropriate RTI, the board manufacturer must also make the appropriate samples, again perform the conductor tear strength at different temperatures, different widths, the layered bond observation and the flame resistance test of the coated solder resist material to determine the board. Manufacturer's production capabilities. Under the proper polymerization conditions, the flame resistance of the heat dissipating material is usually unquestionable; as for the performance of other characteristics, it is a considerable test for the heat dissipating material.
In spite of the requirements for new applications, in order to achieve the combination of copper foil and heat-dissipating materials, dimensional stability, temperature resistance and flame resistance, epoxy resin is compared with acrylic resin (Acrylic) or silicone resin (Silicon). It is also the most convenient modified matrix (Matrix).
The heat dissipation capacity of the material is mostly through the addition of inorganic ceramic particles (non-conducting but heat-conducting, metal particles can not be used due to conduction) to achieve heat dissipation requirements; while the amount of addition and dispersion will affect the bonding of epoxy resins. Sex.
In general, when the weight is added by more than 10%, not only the hardening property is not well mastered, but the bonding ability with the copper foil conductor is likely to fall below the standard, and even embrittlement or delamination directly occurs after baking. In the case of poor dispersion or particle shape imperfections, heterogeneous or anisotropic may occur. Although nano-scale particle dispersion has been shown to reduce the amount of addition and maintain heat dissipation characteristics while reducing other environmental characteristics, the nano-scale particles have high cost, and how to add a large amount of it to a viscous epoxy resin remains The existence and dispersion of the meter level is also a challenge of high difficulty and high cost.
in conclusionLED heat-dissipating substrate maintains the development of high-efficiency LED lighting, but its technical difficulty and obstacles are no less than LED chip packaging. How to develop substrate materials in advance, how to overcome the safety problem of LED heat-dissipating substrate, will be to maintain Taiwan LED lighting The key to industrial competitive advantage is the key to thinking.
SHENZHEN CHONDEKUAI TECHNOLOGY CO.LTD , https://www.szsiheyi.com