Foreign media broke the news: NetEase company or operating Google Play store?

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Foreign media broke the news: NetEase company or operating Google Play store? From Baidu VR

Due to the review mechanism, Google Play App Store on Android system has not entered the domestic market, but Google has never given up. According to the latest information released by the authority of the US authoritative science and technology media, The Information, Google is talking with NetEase. The latter will operate the Play App Store in China. Whether the two parties will reach a final cooperation is not yet known. In the past two years, there have been reports that Google is ready to let the software stores return to the Chinese market. Google Chairman Schmidt also said that in the Chinese market they need to find a business partner to carry out some of their own business, especially responsible for Communication with government regulators.

Previously, there were rumors that when Google and Huawei jointly launched the Nexus-branded smartphones, they hoped that Huawei could help Play to land in the Chinese market. However, the final cooperation with Huawei did not become a reality.

Of course, if Google Play App Store enters the domestic market, the days are not very good, because the competition is fierce, and now the domestic market has emerged a large number of dominant software stores, such as Tencent, Alibaba, and the stores of different mobile phone manufacturers.

Do you expect Google Play App Store to enter the country?

Blind And Buried Hole PCB

HDI is the English abbreviation for High Density Interconnector. High-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From the first 32-bit computer from HP in 1985 to the large client server with 36 sequential multi-layer printed boards and stacked micro-vias, HDI/mini via technology is undoubtedly the future PCB architecture. Smaller ASICs and FPGAs with smaller device spacing, I/O pins, and embedded passives have shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, which drives Strong demand for HDI/mini vias.
HDI process
First-order process: 1+N+1
Second-order process: 2+N+2
Third-order process: 3+N+3
Fourth-order process: 4+N+4

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