Cost reduction breakthrough: emerging LED packaging becomes the focus
Manufacturers of solid-state lighting are exploring the packaging substrate, type and composition to achieve a perfect balance in price / performance. If the general public is asked to draw an LED picture, it is likely that what they see is still two feet, which are used as LEDs for instrument display. However, the LED packaging technology that illuminates small displays and computers has greatly evolved, and it is probably not recognized by the public as it is lined with the ancestors of the past. Today, LED is facing the third wave of growth cycle, and the increase in its benefits will depend on the demand for general lighting, so packaging technology needs to be more cost-effective. In the total cost of packaged LEDs, the packaging step alone accounts for 45%, and it is not surprising that this step has become the focus of the industry.
YoleDeveloppement believes that the industry wants to further increase the illumination per unit cost, there are two ways to achieve this-increase the performance of each packaged product, to reduce the number of products at the system level, or reduce the cost per unit. Yole pointed out that LED manufacturers have never worked so hard to drive down costs because the need to increase the illumination per unit cost has changed the design philosophy of high-power products. Until last year, Yole observed that in most cases, LED manufacturers strive to increase product performance and product complexity, but now, some manufacturers focus on design methods to reduce costs when packaging products.
Increase cost efficiency, all manufacturers have their own magic weapon
One noteworthy example of this transition is Cree, which places LED chips in packages. In the past, the design trend of many high-power LED manufacturers was to use vertical LEDs. The epitaxial or silicon carbide (SiC) substrate has been removed, and the LED structure has been connected to another carrier wafer. Cree's high-power LEDs use this design structure.
Cree's latest XLamp high-brightness LED XB-D product line was launched in January 2012, returning to the simple method of the previous product-Flip-chip packaging. This product only uses the flip-chip technology that can maintain the original substrate. Cree thinned the SiC epitaxial substrate and subjected the surface treatment (Texturing) on ​​the back to increase the light extraction efficiency. Surface treatment of substrates is not a new technology. Many manufacturers use patterned sapphire substrates (PSS), but Cree uses a simpler and cheaper design. The company uses mechanical saw-like tools to create grooves on the substrate. The angle of these grooves maximizes the efficiency of light extraction. This approach is not only cheap, it also seems to be extremely efficient in generating and emitting light sources, which is a smart design in increasing the illumination per unit cost.
With the exception of Cree, other manufacturers, such as Osram and Philips, want to increase cost efficiency, but their methods are different. Osram still uses the vertical LED structure, Philips still prefers thin film flip chip, but they also removed the sapphire crystal, Cree uses different flip chip wiring technology. Although Philips uses bump technology, Cree uses low-temperature melting crystals to further reduce costs and improve contact thermal resistance. To date, Yole has not observed standardized manufacturing methods.
TV LED production capacity released, mid-power LED cost reduced
Before general lighting, LCD TV backlighting used to be the main driving force for LED sales, but the market expansion situation was not as expected, resulting in an oversupply of power LEDs in TV backplanes and a general increase in general lighting costs. Mid-power LEDs are packaged in a minimalist plastic leadless chip carrier (PLCC). In addition to replacing the inherent fluorescent tubes that must be more dispersed and multi-angle and multi-source, Yole believes that these mid-power LEDs have gradually entered the market using only high-power LEDs , Such as light bulbs or spotlights.
The benefits of inadvertently inserting willows show that manufacturers ’strategies of making certain types of components into different related products are very beneficial to them. First of all, in the field of LED TV, the specifications of the packaged products have been standardized, which is very rare in the LED industry, this move can make the economy larger. Because the LCD TV market is not as strong as expected, a large amount of production capacity has been invested in oversupply of medium-power LEDs, which has further reduced the cost. For some applications, the price per illuminance has become very attractive.
Cost-effectiveness considerations also affect the ways in which LED manufacturers meet the needs of users with different light colors. The demand for warmer light has led the industry to look for technologies outside the Yttrium Aluminum Garnet (YAG) that are widely used in the industry. Manufacturers try to replace some of the cool white light produced by gallium nitride (GaN) emitters with yellow to replace YAG. Yole believes that YAG and its silicon substrate are still the primary form of packaging. However, with the diversified services of the industry, the need to adjust the height of various colors has emerged.
To achieve this goal, manufacturers have added red elements to light colors in two ways. First, at the system level, manufacturers can add red LED chips containing YAG phosphors to standard blue chips. Cree uses this method and calls the method "TrueWhite" technology, which is also used by Osram. Another method is to add red light, mostly phosphors containing nitrides. This approach can be adjusted depending on the application, but for high-brightness LEDs, if red light is to be emitted, the production of this phosphor is very important. The problem is that nitride phosphors are still extremely expensive and difficult to manufacture. In some cases, nitride phosphors are ten to twenty times more expensive than YAG phosphors. If the user is authorized by Nichia, YAG can be used to produce yellow fluorescent powder. If not, a phosphor of silicon compound can be used. But for Hongguang, the market is dominated by Mitsubishi Chemical and its nitride phosphors.
The Rockwell Controllogix processor provides an optional user Memory Module (750K to 8M bytes) that can solve application problems with a large number of input and output points systems (up to 4000 analog and 128000 digital bits). The processor can control local input and output and remote input and output. The processor can monitor input and output in the system via Ethernet EtherNet / IP, ControlNet ControlNet, DeviceNet DeviceNet, and Remote I/O Universal Remote I / O.
When there are multiple processor modules in the Controllogix chassis, and even if there are multiple processor modules in the ControlNet network of the control network, all processors can read input values from all input modules. Any one processor can also control any specific output module. The system configuration specifies which processor is controlled by each output module.
The ControlLogix system is a rack-mounted, modular installation. The Controllogix I/O Modules are modularly mounted. The power module is mounted directly to the left side of the ControlLogix chassis. The Controllogix chassis is available in five types of 4, 7, 10, 13 or 17 slots. The module can be inserted in any slot of the rack. The maximum number of channels for Controllogix I/O modules is 32 channels. The mechanical lock of the removable terminal block of each module prevents the application of erroneous voltages to the module. Input and output modules can be hot plugged.
Rockwell Allen-Bradley: SLC500/1747/1746 MicroLogix/1761/1763/1762/1766/1764
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