Hangzhou Lighting Market New District Xintaitong Lighting Haohao Store has been renovated recently, ending the waiting for many days. The image of the Haohao image store in Hangzhou, the market is bleak, specifications, scale, style, etc. have become a highlight in the industry.
According to Li Ben, the person in charge of Xintaitong Lighting, the newly renovated Xintaitong store has a budget of about 600,000 yuan, and Haohao has a product area of ​​300 square meters. It is divided into sheepskin lamp and PPC area and acrylic area. . At the same time, the other half of the area of ​​Hangzhou Xintaitong Lighting Store is currently undergoing renovation and will become the occupation of brands such as Pinyuan, Sterling, Haicheng, Yalite, Zhongpu and Yuzhixing.
The new Taitung decoration store has a semi-concealed design style, and consumers can walk to any other section in any section of the store. The new Taitong in the new lighting market in Hangzhou and the Taitong, which has just been renovated in the old district, echoed and became a major landscape in the Hangzhou lighting market.
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Electronic Pcb Assembly & Electronic PCBA Printed circuit boards assembly Manufacturing
Topscom offers PCB assembly services. These complement our expertise in electrical, mechanical and electro-mechanical contract assembly.
Our PCBA services encompass both through-hole (conventional) and surface mount (SMT) assembly capabilities. They range from initial production of prototypes
(as part of our NPI process), through to the ongoing manufacture of complex, multi-technology PCBAs, in low to medium volumes.
We produce both leaded and RoHS compliant products, utilising our five Mycronic surface mount placement machines for SMT assembly. Or, we can form, populate and solder through-hole components to PCBs, either by hand or by using our automatic soldering processes.
PCB product realisation services
Our product realisation services take customers through from initial design concepts to full production. Our experienced account managers - along with our engineering, manufacturing and NPI teams - operate in partnership with our customers. We ensure successful new product introductions, on time and within budget.
A typical TOPSCOM product realisation initiative includes:
Design support
DFx
Design for procurement
Design for manufacture
Design for test
Prototypes
"Pilot" (NPI) builds
Volume build
PCB prototyping and NPI
pcba pcb assembly
Our NPI team uses a tried and tested approach, to deliver new product introductions.
Our use of advanced project management tools, including critical path analysis (along with common sense strategies, such as attention to detail and frequent communication), guides customers through the NPI process.
Beginning at the request for quotation (RFQ) stage, the NPI process involves our business development team reviewing the requirements of a product or project and analysing the build pack, data and specifications.
When we receive a purchase order, a formal handover process takes place. We then develop a comprehensive project plan. Our team uses detailed documentation, engineering change and reporting control, to ensure continued information integrity.
An experienced Account Manager acts as the interface between TOPSCOM and our customers. Although, at the same time, we encourage engineer-to-engineer communication. The designated project manager allocates resources and tracks all tasks throughout the NPI process. The result is a seamless transition into manufacturing.
SMT PCB assembly
smt pcb assembly
Since we first complemented our through-hole (conventional) PCB assembly services, by offering customers the ability to place surface mount (SMT) devices, the technology has progressed.
Yet, TOPSCOM has invested in people, processes and some of the finest equipment available. This approach has enabled us to deliver to customers' requirements - in terms of flexibility, responsiveness, quality and lead-times.
We have five Mycronic surface mount placement machines, configured as three fully integrated lines, for the main production. Each line has a DEK Horizon or 265 printer and a BTU 8 zone oven, connected with automatic conveyors and loaders/unloaders, and an in-line Mirtec AOI system. Also, we have invested in off-line setup facilities, including Agilis feeders, to allow the rapid and accurate changeover of jobs.
TOPSCOM`s Mycronic placement machines use rapid-change intelligent feeders that can handle components from 01005 resistors to ball grid array (BGA), and fine pitch devices up to 70mm2. All common (and less common) PCB substrate materials are populated, including FR4, flexi, flexi-rigid and metal backed laminates. Pb (if RoHS exempt) and RoHS compliant Pb-free processes are available, both to IPC-A-610 class 2 or 3 as required.
Solder paste printing is a critical process, which our DEK automatic printers achieve accurately and consistently. They have built-in, automatic optical inspection for verification, "GridLok" PCB supports, and "ProActiv" for ultra-fine pitch printing.
Solder paste reflow is carefully profiled and processed using BTU Pyramax 100A8-zone convection ovens. Our SMT processes are supported by experienced IPC trained technicians, using the latest technology equipment for process set-up and verification. All SMT assemblies are AOI inspected, using in-line and Mirtec AOI systems. First-off verification is assisted using "Extra Eye" guided inspection, with microscopes, Ersa Scope and X-ray available for fine pitch and BGA inspection.
Our materials control facilities include baking ovens and dry storage chambers for correct conditioning and storage of components and assemblies. For modifications and upgrades, two fully equipped fine pitch/BGA re-work stations are available.
Conventional PCB assembly
pcb assembly
As well as investing in surface mount technology, TOPSCOM Manufacturing also has a fully equipped through-hole facility.
These IPC-A-610 trained operators and technicians have an array of tools and equipment at their disposal, to enable them to perform all the operations required by TOPSCOM`s customers. Through-hole components are formed, populated and soldered by hand or automatic soldering processes.
Three dedicated Blundell CMS400(LF) wave solder machines offer volume soldering capability for tin-lead and unleaded solder, depending on the RoHS status of the product being assembled. Manual conformal coating and encapsulation services are also available if required, for customers whose products operate in environments where safety, security or humidity are an issue. With both leaded and lead-free soldering, we have no-clean, solvent, ultrasonic and aqueous cleaning processes available.
The through-hole process can be completed with functional or Teradyne in-circuit ATE test, before shipment or inclusion in the next build process.
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PCB Assembly
PCB test and inspection
TOPSCOM is experienced in designing and implementing a variety of test techniques to ensure products are reliable and thoroughly tested – saving customers' time and money downstream by reducing field failures.
We develop sound test and inspection strategies that verify defined product quality and functionality, in addition to manufacturing process integrity.
Every PCBA undergoes full, high-resolution AOI inspection through Mirtec MV-3L machines on each line, with images retained for several months. All boards are traceable by the individual bar code. A rigorous first-off inspection process is performed on each build, complemented by a robust NPI procedure for new products.
All TOPSCOM production staff are IPC trained and attend residential courses with the equipment manufacturers, as well as ongoing training and development. Build documents and machine programs are produced from customer`s CAD information using Aegis CircuitCAM processing software, with DFT/DFM advice given before committing to orders. This all results in process quality exceeding 5 Sigma. Advanced Ersa rework stations are available for product upgrades and repair of field returns.
Our in-depth technical assessment is based on the following considerations:
Product design requirements
Testability requirements
Component types
Product complexity
Manufacturing process
Product maturity
Product lifecycle implications
By assessing the above factors in detail, we can predict the defects most likely to occur in the manufacturing process. Our customers have boosted both the cost effectiveness and reliability of their end products, by taking this assessment into account.
Since we offer an extensive range of test options, we will provide the most appropriate test strategy for your products.
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Topscom Technology Co., Ltd. , http://www.pcbassemblycn.com