SpeedStack Connector System Released

Molex Corporation, a leading global provider of complete interconnect products, has introduced a SpeedStack mezzanine connector system that supports high-density, low-profile solutions with data rates up to 40 Gbps per differential pair. The connector system includes telecommunications, Ideal for OEMs with limited PCB space in all industries of networking, military, medical electronics and consumer electronics technology, with a stack height of 4.00 to 10.00mm and a pitch of 0.80mm, giving design engineers ultimate flexibility Sex, in order to meet the space constraints without sacrificing performance.

Adam Stanczak, Molex's new product development manager, said: "The market has a large demand for a versatile high-density board-to-board mezzanine solution with space savings, high data rates, and the best airflow characteristics at low stack heights. Molex SpeedStack Connector System Not only does it provide a low-profile, high-speed solution, it also features a special narrow housing design that allows airflow to pass through and enhance system thermal performance.”

The SpeedStack connector system offers 22, 44, 60, 82, 104, and 120 circuit sizes, as well as a series of 6-32 differential pairs for greater flexibility. The 100 Ohm design provides excellent impedance control performance. Molex will launch the 85 Ohm model in June 2013 and support PCIe*Generation(Gen) 3.0 and Intel QuickPath Interconnect (QPI) for next-generation I/O and memory signals. )Claim. The insert-molded wafer design has a protective shielding shell that supports the end position and improves electrical balance. The common ground pin helps provide electrical performance and minimizes crosstalk.