Tensilica Introduces HiFi 3 Audio DSP IP Core for SoC Design

21ic News Tensilica has announced the launch of the HiFi 3 audio DSP (digital signal processor) IP core for (SoC) system-on-chip design. Tensilica's fourth-generation audio DSP delivers high-performance and low-power audio post-processing and voice processing algorithms for smartphones and home entertainment systems while improving the performance of the industry-leading HiFi design architecture from 24 bits To 24/32. Tensilica has licensed HiFi 3 to top smartphone OEMs and top semiconductor manufacturers.

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Tensilica HiFi 3 Audio DSP

Larry Przywara, senior director of multimedia marketing at Tensilica, said: "HiFi 3 DSP is an upgraded version of the HiFi 2 architecture, which is the industry's most popular audio DSP core and has been used in millions of smartphones, Blu-ray players, digital TVs, Among digital cameras and other devices, HiFi 3 was originally designed to meet the power efficiency needs of smartphone OEMs and semiconductor manufacturers for high-performance voice and audio post-processing functions. In particular, it affects audio and video. FFT (Fast Fourier Transform), FIR (Finite Impulse Response) and IIR (Infinite Impulse Response) algorithm libraries for pre/post processing performance are improved by 80% on HiFi3 DSP. In addition to HiFi EP, HiFi 3 The performance of speech coding has increased by more than 1.5 times, and the dramatic increase in performance helps to significantly reduce the power consumption of complex algorithms."

The HiFi 3 Audio/Voice DSP is backward compatible with the proven HiFi 2 and HiFi EP Audio/Voice DSP software algorithm libraries, and the existing HiFi-optimized library of more than 90 audio and speech codecs and audio enhancement algorithms, both It can be run on the HiFi 3 DSP core while dramatically improving its performance. In addition, Tensilica has further optimized the most demanding multi-channel audio algorithm library to make it more efficient to run on HiFi 3. For example, HiFi 3 can support DTS - HD Master Audio Blu-ray playback at 233 MHz. HiFi 3 retains the advantages of HiFi2 and provides convenient programmability, making it ideal for users who wish to migrate their own audio algorithms, using a simplified programming model to improve code writing rates.

Demand for audio post-processing and voice growth At present, most of the innovations in audio technology focus on complex algorithms in the field of audio post-processing, such as volume adjustment, dialogue clarity, volume improvement, space expansion, equalization, and support for 32 games in interactive games. Or more synchronized audio streams and VoIP (Internet Voice Protocol). These complex algorithms are widely used in the design of smartphones, home entertainment systems and gaming consoles.

The demand for voice on smartphones far exceeds Moore's Law and battery technology. The current narrow-band speech codec technology and basic noise suppression technology require audio DSP performance of approximately 200 MHz, with the widespread use of AMR-WB (Adaptive Multi-Rate Wideband) speech coding technology, and the Skype SILK for VoIP. Wideband codec technology, improved noise suppression technology and other pre-processing functions, such as noise-based volume control technology, will exceed 600MHz in a few years.

Meeting these needs In order to meet the growing demand for audio, the HiFi 3 audio/voice DSP has improved performance by more than 80% for the FFT, FIR and IIR algorithms commonly used in post-processing algorithms. Compared to HiFi EP, HiFi 3 has improved processing performance by 1.8 times in DTS-HD Master Audio. HiFi 3 is optimized for common algorithms in the ITU voice codec, delivering more than 50% performance improvement while greatly reducing the difficulty of porting.

HiFi 3 Audio/Voice DSP is a 3-way long instruction word DSP based on Tensilica's Xtensa Data Processor (DPU) architecture with 4 MACs (multiply accumulation unit), a 64-bit load/store unit, and a standard 16 entry 64-bit register file.

HiFi 3 was fully launched in March.

Maximum module conversion efficiency up to 17.21%

Positive power tolerance 0~+3%

Severe environment resistance

Wind load 2400 pascal

Snow load 5400 pascal

Highly transparent low iron tempered glass

Excellent performance under low light environment

Anodized aluminum for improving corrosion resistance

Certification IEC61215&IEC61730

10-year product warranty for repair and workmanship

25-year warranty for power output

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